isibhengezo_sekhasi

I-Vacuum Chuck ye-SiC enezimbobo Enensimbi Yokuphatha I-Wafer Egobile Nencane

I-Vacuum Chuck ye-SiC enezimbobo Enensimbi Yokuphatha I-Wafer Egobile Nencane

Incazelo emfushane:

I-St.Cera's metal based ceramic vacuum chuck ihlanganisa ungqimba lwe-ceramic olunezimbobo ze-silicon carbide (SiC) nesisekelo sensimbi esenziwe ngomshini oqondile (i-aluminium noma insimbi engagqwali). Izinto ze-SiC ezinezimbobo (oluhlaza okwesibhakabhaka-omnyama, izimbobo ezingu-35–40%, usayizi we-pore 20–30 μm, ukuvuleka okungu-60 ml/cm²·min) zinikeza ukusatshalaliswa kwe-vacuum okufanayo, okumnene kulo lonke ubuso be-wafer, kususa ukumakwa komphetho futhi kuvumela ukwesekwa okungenakuthintana kwama-wafer amancane (≤100 μm) noma asontekile. Ungqimba lwe-SiC lunikeza ukwanda okuphansi kokushisa (3.5×10⁻⁶/℃), ukuzinza kokushisa kufika ku-1000°C, kanye namandla okuguquguquka aphakathi (32–35 MPa). Isisekelo sensimbi sengeza ukuqina kwesakhiwo, ukufakwa kalula ngezimbobo ezinezintambo, kanye nokuvikelwa ekuqhekekeni okuqhekekile. Le chuck ilungele ukugaya ngemuva, ukunquma, kanye nokucubungula i-wafer yokushisa okuphezulu lapho i-vacuum efanayo kanye nokuhambisana kokushisa kubalulekile.

 


Imininingwane Yomkhiqizo

Amathegi Omkhiqizo

I-St.Cera's metal based ceramic vacuum chuck ihlanganisa ungqimba lwe-ceramic olunezimbobo ze-silicon carbide (SiC) nesisekelo sensimbi esenziwe ngomshini oqondile (i-aluminium noma insimbi engagqwali). Izinto ze-SiC ezinezimbobo (oluhlaza okwesibhakabhaka-omnyama, izimbobo ezingu-35–40%, usayizi we-pore 20–30 μm, ukuvuleka okungu-60 ml/cm²·min) zinikeza ukusatshalaliswa kwe-vacuum okufanayo, okumnene kulo lonke ubuso be-wafer, kususa ukumakwa komphetho futhi kuvumela ukwesekwa okungenakuthintana kwama-wafer amancane (≤100 μm) noma asontekile. Ungqimba lwe-SiC lunikeza ukwanda okuphansi kokushisa (3.5×10⁻⁶/℃), ukuzinza kokushisa kufika ku-1000°C, kanye namandla okuguquguquka aphakathi (32–35 MPa). Isisekelo sensimbi sengeza ukuqina kwesakhiwo, ukufakwa kalula ngezimbobo ezinezintambo, kanye nokuvikelwa ekuqhekekeni okuqhekekile. Le chuck ilungele ukugaya ngemuva, ukunquma, kanye nokucubungula i-wafer yokushisa okuphezulu lapho i-vacuum efanayo kanye nokuhambisana kokushisa kubalulekile.

 

Imininingwane (ngokusekelwe kudatha ye-SiC enezimbobo enikeziwe):

Impahla Inani
Izinto Zobumba I-Silicon Carbide Enezimbobo (i-SiC ≥80%)
Umbala Okuluhlaza okwesibhakabhaka-omnyama
Ukubhoboka 35–40%
Usayizi Wembobo 20–30 μm
Ubuningi 2.1–2.3 g/cm³
Ukuvunyelwa komoya 60 ml/cm²·min
Amandla Okugobeka 32–35 MPa
I-Coefficient Yokukhulisa Ukushisa (25-1000°C) 3.5×10⁻⁶/℃
Izinga Lokushisa Eliphezulu Lokusebenza 1000°C
Ukumelana Nogesi 10⁻¹⁰ Ω/cm (ngedatha enikeziwe, ejwayelekile ye-SiC evulekile)
Izinto Eziyisisekelo Zensimbi I-Aluminium 6061 noma i-Stainless Steel 304 (ongakukhetha)
Ubukhulu Besisekelo Sensimbi 10–30 mm (ngokwezifiso)

Qaphela: Amandla okugobeka aphansi kune-SiC ejiyile ngenxa yokubhoboka. Izakhiwo zesisekelo sensimbi aziveli ematafuleni e-ceramic.

 

Izicelo:

  • · Ukugaya ama-wafer amancane ngemuva (≤100 μm)
  • · Ukufakwa kwe-wafer egobile ukuze kunqunywe
  • · Ukuthulula i-wafer eshisa kakhulu (kufika ku-1000°C)
  • · Ukufaka i-vacuum kuma-substrate anezimbobo noma abuthakathaka

 

Ukukhiqiza:

Ipuleti le-SiC elinombobo (elakhiwe ngama-pore formers, elicwebezelwe) → elihlanganiswe lafinyelela ekubeni yisicaba ≤10 μm → isisekelo sensimbi esenziwe ngama-vacuum ports kanye nezici zokufaka → i-epoxy bonding noma i-mechanical clamping → ukuhlolwa kokuvuza kwe-helium.

 

Ikhwalithi yokulawula:

  • · Ubukhulu be-Porosity kanye ne-pore buqinisekiswe yi-SEM
  • · Ukuhlolwa kokungena kwamanzi (ukugeleza komoya)
  • · Ukuthamba okulinganiswe nge-laser interferometer
  • · Izinga lokuvuza kwe-Helium <1×10⁻⁹ Pa·m³/s

 

Izinzuzo ngaphezu kwama-Grooved noma ama-Dense Ceramic Chucks:

  • · Akukho ukumaka kwe-wafer – i-vacuum efanayo engenazo izimbobo ezihlukene
  • · Izimbobo ezizihlanzayo – ukuncipha kokuvaleka
  • · Izibambo zama-wafer asontekile (kufika ku-500 μm bow)
  • · Isisekelo sensimbi sivimbela ukuphuka okuqhekekile futhi senza kube lula ukuhlanganiswa

 

Imikhawulo:

  • · Amandla aphansi okugobeka (32–35 MPa) – gwema ukulayisha okunamandla
  • · Izinga lokushisa lokusebenza lilinganiselwe ku-1000°C (i-SiC embozwe yizimbobo), kodwa isibopho se-epoxy sesisekelo sensimbi silinganiselwe ku-≤200°C ngaphandle kokuthi siboshwe ngomshini
  • · Akuyona i-vacuum enomfutho ophezulu (isakhiwo esinezimbobo sinciphisa umehluko omkhulu we-vacuum)

 

Ukwenza ngokwezifiso:

  • · Isisekelo sensimbi: i-aluminium (ekhanyayo), insimbi engagqwali (emelana nokugqwala), i-Invar (ukwanda okuphansi)
  • · Ukubopha: i-epoxy (≤200°C) noma i-mechanical clamp (kufika ku-500°C)
  • · Indandatho yokuvala umphetho yokulawula i-vacuum ye-zone

 

Sicela uqaphele: Amandla okuguquguquka anikeziwe (32–35 MPa) aphansi kakhulu kune-ceramics eziqinile ngenxa yokubhoboka. Phatha ngokucophelela ukuze ugweme ukuqhekeka komphetho.


  • Okwedlule:
  • Olandelayo: